Article de journal
Kneip, A., Lefebvre, M., Maistriaux, P., & Bol, D. (2025). IMAGINE: An 8-to-1b 22nm FD-SOI Compute-In-Memory CNN Accelerator With an End-to-End Analog Charge-Based 0.15-8POPS/W Macro Featuring Distribution-Aware Data Reshaping. IEEE Transactions on Circuits and Systems for Artificial Intelligence, 2(3), 222-235. https://doi.org/10.1109/tcasai.2025.3576323 (Original work published 2025)
Lefebvre, M., & Bol, D. (2025). MANTIS: A Mixed-Signal Near-Sensor Convolutional Imager SoC Using Charge-Domain 4b-Weighted 5-to-84-TOPS/W MAC Operations for Feature Extraction and Region-of-Interest Detection. IEEE Journal of Solid State Circuits, 60(3), 934-948. https://doi.org/10.1109/JSSC.2024.3484766 (Original work published 2025)
Lefebvre, M., & Bol, D. (2025). A nA-Range Area-Efficient Sub-100-ppm/°C Peaking Current Reference Using Forward Body Biasing in 0.11-µm Bulk and 22-nm FD-SOI. IEEE Journal of Solid State Circuits, 60(2), 579-592. https://doi.org/10.1109/jssc.2024.3406423 (Original work published 2025)
Papier de conférence
Dethienne, R., Louveaux, J., & Bol, D. (2025). A Power Consumption Model for Customer Premise Equipment: Methodology and Application. The 33rd International Conference on Software, Telecommunications, and Computer Networks (SoftCOM 2025), Split, Croatia.
Favresse, S., Maistriaux, P., Harpe, P., Flandre, D., & Bol, D. (2025). An Ultra-Low-Power Dual-Channel Analog Front End for Vagus Nerve Sensing with Chopping-Minimized Gain Mismatch. 2025 IEEE Biomedical Circuits and Systems Conference (BioCAS), 121-125. https://doi.org/10.1109/BioCAS67066.2025.00036 (Original work published 2025)
Chapitre de livre
Pirson, T., Le Brun, G., Ernesto Quisbert-Trujillo, Thomas Ernst, Raskin, J.-P., & Bol, D. (2024). Towards Life Cycle Thinking and Judicious Ecodesign for the Internet of Things (IoT) Current Practices and Perspectives. In Jenny Stanford Publishing (ed.), Outlooking beyond Nanoelectronics and Nanosystems (Ultra Scaling, Pervasiveness, Sustainable Integration, and Biotic Cross-Inspiration (1st Edition), p. p. 75-136). Simon Deleonibus. https://doi.org/10.1201/9781003509905
Article de journal
Gauthier Roussilhe, Pirson, T., Mathieu Xhonneux, & Bol, D. (2024). From silicon shield to carbon lock-in? The environmental footprint of electronic components manufacturing in Taiwan (2015–2020). Journal of Industrial Ecology, 28(5), 1212-1226. https://doi.org/10.1111/jiec.13487 (Original work published 2024)
Lefebvre, M., & Bol, D. (2024). A 2.5-nA Area-Efficient Temperature-Independent 176-/82-ppm/°C CMOS-Only Current Reference in 0.11-µm Bulk and 22-nm FD-SOI. IEEE Journal of Solid State Circuits, 59(11), 3752-3766. https://doi.org/10.1109/jssc.2024.3402960 (Original work published 2024)
Favresse, S., Bol, D., & Flandre, D. (2024). A Combined Analytical and Simulation-Based Methodology for Quantifying the Noise-Power-Area Trade-Offs in Biomedical Amplifiers. IEEE Transactions on Circuits and Systems I: Regular Papers, 71(12), 6177-6189. https://doi.org/10.1109/TCSI.2024.3414649 (Original work published 2024)
Papier de conférence
Gonzalez Gonzalez, M. A., Maistriaux, P., & Bol, D. (2024). A Narrowband RF Front End in 22-nm FD-SOI Featuring a Programmable Low-Noise Amplifier with a Configurable Noise-Power Trade-Off. IEEE International Symposium on Circuits and Systems. Proceedings. Published. 2024 IEEE International Symposium on Circuits and Systems (ISCAS), Singapore, Singapore. https://doi.org/10.1109/iscas58744.2024.10557855 (Original work published 2024)
Maistriaux, P., Gonzalez Gonzalez, M. A., Louveaux, J., & Bol, D. (2024). Leveraging a Digital Chirp Spread Spectrum Detector for LPWAN Wake-Up Receivers. 2024 14th International Symposium on Communication Systems, Networks and Digital Signal Processing (CSNDSP), 638-645. https://doi.org/10.1109/csndsp60683.2024.10636391 (Original work published 2024)
Favresse, S., Bol, D., & Flandre, D. (2024). A 1.88-NEF 3-kHz Current-Reuse Common-Gate Amplifier Featuring Resistorless High-Pass Filtering. Proceedings of the 2024 31st IEEE International Conference on Electronics, Circuits and Systems (ICECS). Published. IEEE International Conference on Electronics, Circuits and Systems (ICECS), Nancy, France. https://doi.org/10.1109/ICECS61496.2024.10848910 (Original work published 2024)
Lefebvre, M., & Bol, D. (2024). A Mixed-Signal Near-Sensor Convolutional Imager SoC with Charge-Based 4b-Weighted 5-to-84-TOPS/W MAC Operations for Feature Extraction and Region-of-Interest Detection. Proceedings of the 2024 IEEE Custom Integrated Circuits Conference (CICC), 1-2. https://doi.org/10.1109/CICC60959.2024.10528961 (Original work published 2024)
Wattiez, A., Dethienne, R., Collin, A.-S., & Bol, D. (2024). Parametric Modeling for Improved Die Area Estimation in the Life Cycle Assessment of Electronic Systems. Electronics Goes Green 2024+, Berlin.
Golard, L., Agram, Y., Rottenberg, F., Quitin, F., Bol, D., & Louveaux, J. (2024). A Parametric Power Model of Multi-Band Sub-6 GHz Cellular Base Stations Using On-Site Measurements. IEEE International Symposium Personal, Indoor and Mobile Radio Communications. Published. 2024 IEEE 35th Annual International Symposium on Personal, Indoor and Mobile Radio Communications (PIMRC), Valencia, Spain. https://doi.org/10.1109/PIMRC59610.2024.10817448 (Original work published 2024)
Article de journal
Frenkel, C., Bol, D., & Indiveri, G. (2023). Bottom-Up and Top-Down Approaches for the Design of Neuromorphic Processing Systems: Tradeoffs and Synergies Between Natural and Artificial Intelligence. Proceedings of the IEEE, 111(6), 623-652. https://doi.org/10.1109/jproc.2023.3273520 (Original work published 2023)
Xu, P., Flandre, D., & Bol, D. (2023). Analysis and Design of RF Energy-Harvesting Systems with Impedance-Aware Rectifier Sizing. IEEE TRANSACTIONS ON CIRCUITS AND SYSTEMS—II: EXPRESS BRIEFS, 70(2), 367-365. https://doi.org/10.1109/TCSII.2022.3171470 (Original work published 2023)
Kneip, A., & Bol, D. (2023). A 7T-NDR Dual-Supply 28nm FD-SOI Ultra-Low Power SRAM with 0.23nW/kB Sleep Retention and 0.8pJ/32b Access at 64MHz with Forward Back Bias. IEEE Transactions on Circuits and Systems Part 1: Regular Papers, 70(3), 1311-1323. https://doi.org/10.1109/TCSI.2022.3230984 (Original work published 2023)
Pirson, T., Delhaye, T. P., Pip, A., Le Brun, G., Raskin, J.-P., & Bol, D. (2023). The Environmental Footprint of IC Production: Review, Analysis and Lessons from Historical Trends. IEEE Transactions on Semiconductor Manufacturing, 36, 56-67. https://doi.org/10.1109/tsm.2022.3228311 (Original work published 2023)
Gonzalez Gonzalez, M. A., Xu, P., Dekimpe, R., Schramme, M., Stupia, I., Pirson, T., & Bol, D. (2023). Technical and Ecological Limits of 2.45-GHz Wireless Power Transfer for Battery-Less Sensors. IEEE Internet of Things Journal, 10(17), 15431-15442. https://doi.org/10.1109/JIOT.2023.3263976 (Original work published 2023)
Lefebvre, M., Flandre, D., & Bol, D. (2023). A 1.1- / 0.9-nA Temperature-Independent 213- / 565-ppm/°C Self-Biased CMOS-Only Current Reference in 65-nm Bulk and 22-nm FDSOI. IEEE Journal of Solid State Circuits, 58(8), 2239-2251. https://doi.org/10.1109/jssc.2023.3240209 (Original work published 2023)
Schramme, M., & Bol, D. (2023). UFBBR: A Unified Frequency and Back-Bias Regulation Unit for Ultralow-Power Microcontrollers in 28-nm FDSOI. IEEE Transactions on Circuits and Systems I: Regular Papers, 70(6), 2464-2477. https://doi.org/10.1109/tcsi.2023.3257270 (Original work published 2023)
Golard, L., Louveaux, J., & Bol, D. (2023). Evaluation and projection of 4G and 5G RAN energy footprints: the case of Belgium for 2020–2025. Annales des Télécommunications, online. https://doi.org/10.1007/s12243-022-00932-9 (Original work published 2023)
Xhonneux, M., Louveaux, J., & Bol, D. (2023). A Sub-mW Cortex-M4 Microcontroller Design for IoT Software-Defined Radios. IEEE Open Journal of Circuits and Systems, 4(4), 165-175. https://doi.org/10.1109/ojcas.2023.3270752 (Original work published 2023)
Kneip, A., Lefebvre, M., Maistriaux, P., & Bol, D. (2023). IMPACT: A 1-to-4b 813-TOPS/W 22-nm FD-SOI Compute-in-Memory CNN Accelerator Featuring a 4.2-POPS/W 146-TOPS/mm² CIM-SRAM With Multi-Bit Analog Batch-Normalization. IEEE Journal of Solid State Circuits, 58(7), 1871-1884. https://doi.org/10.1109/JSSC.2023.3269098 (Original work published 2023)
Papier de conférence
Gonzalez Gonzalez, M. A., & Bol, D. (2023). Post-Silicon Optimization of a Highly Programmable 64-MHz PLL Achieving 2.7-5.7 μW. Proceedings of the 2023 Design, Automation & Test in Europe Conference & Exhibition (DATE). Published. 2023 Design, Automation & Test in Europe Conference & Exhibition (DATE), Antwerp, Belgium. https://doi.org/10.23919/date56975.2023.10137143 (Original work published 2023)
Pirson, T., Golard, L., & Bol, D. (2023). Evaluating the (ir)relevance of IoT solutions with respect to environmental limits based on LCA and backcasting studies. Proc. Ninth Computing within Limits 2023, 9(1), 14 p. https://doi.org/10.21428/bf6fb269.6af396ff (Original work published 2023)
Van Brandt, L., Silveira, F., Delvenne, J.-C., Bol, D., & Flandre, D. (2023). Variability and Intrinsic Noise Effects in ULV CMOS SRAM Demystified. IEEE Latin American Electron Devices Conference 2023, Puebla, Mexico.
Rapport
Pirson, T., & Bol, D. (2023). Modélisation du cout énergétique et écologique d’objets connectés et de processus de digitalisation.
Brevet
Xu, P., Bol, D., & Flandre, D. (2023). Energy harvesting system.
Papier de conférence
Kneip, A., Lefebvre, M., Verecken, J., & Bol, D. (2022). A 1-to-4b 16.8-POPS/W 473-TOPS/mm2 6T-based In-Memory Computing SRAM in 22nm FD-SOI with Multi-Bit Analog Batch-Normalization. ESSCIRC 2022. Published. ESSCIRC 2022- IEEE 48th European Solid State Circuits Conference (ESSCIRC), Milan, Italy. https://doi.org/10.1109/ESSCIRC55480.2022.9911348
Lefebvre, M., Flandre, D., & Bol, D. (2022). A 0.9-nA Temperature-Independent 565-ppm/°C Self-Biased Current Reference in 22-nm FDSOI. Proceedings of the ESSCIRC 2022- IEEE 48th European Solid State Circuits Conference (ESSCIRC), 469-472. https://doi.org/10.1109/ESSCIRC55480.2022.9911369 (Original work published 2022)
Dekimpe, R., & Bol, D. (2022). Mixed-Signal Compensation of Tripolar Cuff Electrode Imbalance in a Low-Noise ENG Analog Front-End. ESSCIRC 2022. Published. ESSCIRC 2022- IEEE 48th European Solid State Circuits Conference (ESSCIRC), Milan, Italy. https://doi.org/10.1109/ESSCIRC55480.2022.9911326
Pirson, T., Delhaye, T., Pip, A., Le Brun, G., Raskin, J.-P., & Bol, D. (2022). The Environmental Footprint of IC Production: Meta-Analysis and Historical Trends. ESSDERC 2022 - IEEE 52nd European Solid-State Device Research Conference (ESSDERC), pp. 352-355. https://doi.org/10.1109/essderc55479.2022.9947198
Maistriaux, P., Pirson, T., Schramme, M., Louveaux, J., & Bol, D. (2022). Modeling the Carbon Footprint of Battery-Powered IoT Sensor Nodes for Environmental-Monitoring Applications. IoT 2022: Proceedings of the 12th International Conference on the Internet of Things. Published. IoT 2022: The 12th International Conference on the Internet of Things, Delft Netherlands. https://doi.org/10.1145/3567445.3567448
Article de journal
Lefebvre, M., & Bol, D. (2022). A Family of Current References Based on 2T Voltage References: Demonstration in 0.18-μm With 0.1-nA PTAT and 1.1-μA CWT 38-ppm/°C Designs. IEEE Transactions on Circuits and Systems I: Regular Papers, 69(8), 3237-3250. https://doi.org/10.1109/TCSI.2022.3172647 (Original work published 2022)
Schramme, M., Van Brandt, L., Flandre, D., & Bol, D. (2022). Comprehensive Analytical Comparison of Ring Oscillators in FDSOI Technology: Current Starving Versus Back-Bias Control. IEEE TRANSACTIONS ON CIRCUITS AND SYSTEMS—I: REGULAR PAPERS, 69(5), 1883-1895. https://doi.org/10.1109/TCSI.2022.3144527 (Original work published 2022)
Degavre, F., Kieffer, S., Bol, D., Dekimpe, R., Desterbecq, C., Pirson, T., Sandu, G., & Tubeuf, S. (2022). Searching for sustainability in health systems: Toward a multidisciplinary evaluation of mobile health innovations. Sustainability (Online), 14(9), 5286. (Original work published 2022)
Dekimpe, R., & Bol, D. (2022). ECG Arrhythmia Classification on an Ultra-Low-Power Microcontroller. IEEE Transactions on Biomedical Circuits and Systems, 16(3), 456-466. (Original work published 2022)
Van Brandt, L., Saeidi, R., Bol, D., & Flandre, D. (2022). Accurate and Insightful Closed-Form Prediction of Subthreshold SRAM Hold Failure Rate. IEEE TRANSACTIONS ON CIRCUITS AND SYSTEMS—I: REGULAR PAPERS, 69(7), 2767-2780. https://doi.org/10.1109/TCSI.2022.3164680 (Original work published 2022)
Document de travail
Dekimpe, R., Pirson, T., & Bol, D. (2022). Systemic Approach to the Environmental Sustainability of Mobile Health.
Article de journal
Frenkel, C., Lefebvre, M., & Bol, D. (2021). Learning Without Feedback: Fixed Random Learning Signals Allow for Feedforward Training of Deep Neural Networks. Frontiers in Neuroscience, 15, 629892. https://doi.org/10.3389/fnins.2021.629892 (Original work published 2021)
Dekimpe, R., & Bol, D. (2021). A Configurable ULP Instrumentation Amplifier with Pareto-Optimal Power-Noise Trade-Off Achieving 1.93 NEF in 65nm CMOS. IEEE Transactions on Circuits and Systems. Part 2: Express Briefs, 68(7), 2272-2276. https://doi.org/10.1109/TCSII.2021.3059311 (Original work published 2021)
Tapperel, J., Xhonneux, M., Bol, D., Louveaux, J., & Burg, A. (2021). Enhancing the Reliability of Dense LoRaWAN Networks With Multi-User Receivers. IEEE Open Journal of the Communications Society, 2, 2725-2738. https://doi.org/10.1109/OJCOMS.2021.3134091 (Original work published 2021)
Xu, P., Flandre, D., & Bol, D. (2021). A Self-Gating RF Energy Harvester for Wireless Power Transfer With High-PAPR Incident Waveform. IEEE Journal of Solid State Circuits, 56(6), 1816-1826. https://doi.org/10.1109/jssc.2021.3061196 (Original work published 2021)
Pirson, T., & Bol, D. (2021). Assessing the embodied carbon footprint of IoT edge devices with a bottom-up life-cycle approach. Journal of Cleaner Production, 322(128966), 13. https://doi.org/10.1016/j.jclepro.2021.128966 (Original work published 2021)
Moreau, N., Pirson, T., Le Brun, G., Delhaye, T., Sandu, G., Paris, A., Bol, D., & Raskin, J.-P. (2021). Could Unsustainable Electronics Support Sustainability. Sustainability, 13(6541), 7. https://doi.org/10.3390/su13126541 (Original work published 2021)
Kneip, A., & Bol, D. (2021). Impact of Analog Non-Idealities on the Design Space of 6T-SRAM Current-Domain Dot-Product Operators for In-Memory Computing. IEEE Transactions on Circuits and Systems Part 1: Regular Papers, 68(5), 1931-1944. https://doi.org/10.1109/TCSI.2021.3058510 (Original work published 2021)
Bol, D., Schramme, M., Moreau, L., Xu, P., Dekimpe, R., Saeidi, R., Haine, T., Frenkel, C., & Flandre, D. (2021). SleepRunner: A 28-nm FDSOI ULP Cortex-M0 MCU With ULL SRAM and UFBR PVT Compensation for 2.6–3.6-μW/DMIPS 40–80-MHz Active Mode and 131-nW/kB Fully Retentive Deep-Sleep Mode. IEEE Journal of Solid State Circuits, 56(7), 2256-2269. https://doi.org/10.1109/JSSC.2021.3056219 (Original work published 2021)
Xhonneux, M., Afisiadis, O., Bol, D., & Louveaux, J. (2021). A Low-Complexity LoRa Synchronization Algorithm Robust to Sampling Time Offsets. IEEE Internet of Things Journal, 14. https://doi.org/10.1109/JIOT.2021.3101002 (Original work published 2021)
Papier de conférence
Klinefelter, A., Liu, H., Benini, L., Thonnart, Y., Bowman, K., Wilcox, K., Bol, D., Loke, A., & Shacham, O. (2021). SE2: Going Remote: Challenges and Opportunities to Remote Learning, Work, and Collaboration. 2021 IEEE International Solid- State Circuits Conference (ISSCC), San Francisco, CA, USA.
Dekimpe, R., Schramme, M., Lefebvre, M., Kneip, A., Saeidi, R., Xhonneux, M., Moreau, L., Gonzalez Gonzalez, M. A., Pirson, T., & Bol, D. (2021). SleepRider: a 5.5µW/MHz Cortex-M4 MCU in 28nm FD-SOI with ULP SRAM, Biomedical AFE and Fully-Integrated Power, Clock and Back-Bias Management. Proceedings of the 2021 Symposium on VLSI Circuits, 2. https://doi.org/10.23919/VLSICircuits52068.2021.9492365 (Original work published 2021)
Bol, D., Pirson, T., & Dekimpe, R. (2021). Moore’s Law and ICT Innovation in the Anthropocene. Proceedings of the IEEE Design, Automation and Test in Europe Conference 2021. IEEE Design, Automation and Test in Europe Conference 2021, Virtual conference.
Pirson, T., Bol, D., Le Brun, G., & Raskin, J.-P. (2021). Can we cope with the upcoming massive deployment of IoT within environmental limits? Educational workshop of IEEE ESSDERC, Grenoble (France).
Degavre, F., Bol, D., Kieffer, S., Sandu, G., Desterbecq, C., Pirson, T., Dekimpe, R., & Tubeuf, S. (2021). Accelerating sustainability transitions in care and health systems: How sustainable are e/m-Care and Health innovations? Transforming Care Conference, Cà Foscari University of Venice, Italy.
Degavre, F., Kieffer, S., Bol, D., Sandu, G., Desterbecq, C., Pirson, T., Dekimpe, R., & Tubeuf, S. (2021). Toward an interdisciplinary evaluation of mobile health innovations: Searching for sustainability in health systems. CONFERENCE RECHERCHE INTERDISCIPLINAIRE ET TRANSDISCIPLINAIRE « TRANSITION ET DÉVELOPPEMENT DURABLE », UCLouvain.
Lefebvre, M., Moreau, L., Dekimpe, R., & Bol, D. (2021). A 0.2-to-3.6TOPS/W Programmable Convolutional Imager SoC with In-Sensor Current-Domain Ternary-Weighted MAC Operations for Feature Extraction and Region-of-Interest Detection. IEEE International Solid State Circuits Conference. Digest of Technical Papers, 118-119. (Original work published 2021)
Xhonneux, M., Louveaux, J., & Bol, D. (2021). Implementing a LoRa Software-Defined Radio on a General-Purpose ULP Microcontroller. Proceedings of the 2021 International Workshop on Signal Processing Systems. Published. International Workshop on Signal Processing Systems 2021, Coimbra (Portugal).
Xhonneux, M., Tapparel, J., Scheepers, P., Afisiadis, O., Balatsoukas-Stimming, A., Bol, D., Louveaux, J., & Burg, A. (2021). A Two-User Successive Interference Cancellation LoRa Receiver with Soft-Decoding. 2021 Asilomar Conference on Signals, Systems, and Computers, Pacific Grove, CA, USA.
Document de travail
Charlotte Frenkel, Bol, D., & Giacomo Indiveri. (2021). Bottom-Up and Top-Down Neural Processing Systems Design: Neuromorphic Intelligence as the Convergence of Natural and Artificial Intelligence.
Article de journal
Levi, I., Bellizia, D., Bol, D., & Standaert, F.-X. (2020). Ask Less, Get More: Side-Channel Signal Hiding, Revisited. IEEE Transactions on Circuits and Systems Part 1: Regular Papers, 67(12), 4904-4917. https://doi.org/10.1109/TCSI.2020.3005338 (Original work published 2020)
Gimeno Gasca, C., Flandre, D., Schramme, M., Frenkel, C., & Bol, D. (2020). A 2.24-pJ/bit 2.5-Gb/s UWB receiver in 28-nm FDSOI CMOS for low-energy chip-to-chip communications. A E Ue: International Journal of Electronics and Communication, 114(152996), 8. https://doi.org/10.1016/j.aeue.2019.152996 (Original work published 2020)
Schramme, M., Gimeno Gasca, C., Cathelin, A., Flandre, D., & Bol, D. (2020). A 2.5-GHz Clock Recovery Circuit Based on a Back-Bias-Controlled Oscillator in 28-nm FDSOI. IEEE Solid-State Circuits Letters, 3, 478-481. https://doi.org/10.1109/LSSC.2020.3026759 (Original work published 2020)
Chapitre de livre
Bol, D., & de Streel, G. (2020). An 802.15.4 IR-UWB Transmitter SoC with Adaptive-FBB-Based Channel Selection and Programmable Pulse Shape. In Sylvain Clerc, Thierry Di Gilio, Andreia Cathelin (ed.), The Fourth Terminal, Integrated Circuits and Systems (p. p. 223-241). Springer Nature Switzerland AG 2020. https://doi.org/10.1007/978-3-030-39496-7_9
Papier de conférence
Flandre, D., Schramme, M., Gimeno Gasca, C., Drouguet, M., André, N., Craeye, C., & Bol, D. (2020). Cinq générations de chips UWB (Ultra-Wide-Band) pour la géo-localisation et la transmission de données à très basse consommation. FETCH 2020 - École d’hiver Francophone sur les Technologies de Conception des Systèmes Embarqués Hétérogènes, Montréal (Canada).
Frenkel, C., Legat, J.-D., & Bol, D. (2020). A 28-nm Convolutional Neuromorphic Processor Enabling Online Learning with Spike-Based Retinas. Proceedings of ISCAS 2020, 5. https://doi.org/10.1109/ISCAS45731.2020.9180440 (Original work published 2020)
